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PAC



The Industrial Technology Research Institute (ITRI) PAC (Parallel Architecture Core) project was initiated in 2003. The target is to develop a low-power and high-performance programmable SoC platform for multimedia applications. In the first PAC project phase (2004~2006), a 5-way VLIW DSP (PACDSP) processor has been developed with our patented distributed & ping-pong register file and variable-length VLIW encoding techniques. A dual-core PAC SoC, which is composed of a PACDSP core and an ARM9 core, has also been designed to demonstrate its outstanding performance and energy efficiency for multimedia processing such as real-time H.264 codec. The latest PAC Duo SoC consists of an ARM 9 core and two PACDSP V3X cores. In this offical PAC project website, we'll provide product information and documentation services for our PAC series products.

 PAC_Duo_spec_n_features

 Demo_Video_Here!

 

Announcement

  The latest announcement of PAC Duo SoC EVB or information of this Website will be announced here.

 

Activity Info.

There are some activities or courses which may have relationships with our PACDSP or PAC Duo SoC and platform. However, not all people will be informed. We'll put such information here.

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The 2012 CIC 「多核心平台經驗分享研討會」 will be held. Please complete your registration before May 4, 2012, if you are interested in it. It's completely FREE!

PACDSP



PACDSP V3 is the ISA of a 32-bit VLIW DSP developed in ITRI, which combines the high-performance and low-power signal processing capability of ASIC and the flexibility of microprocessor. Its microarchitecture features scalable datapath for easy adaptation to different applications, an innovative and patented distributed register organization, a rich & optimized instruction set with 8-bit/16-bit SIMD operations, and a high-performance memory subsystem. You may download manuals and toolchains here.

 

PAC EVB



PAC Duo SoC was designed to provide outstanding performance and energy efficiency for multimedia processing.  It consists of one ARM926EJ-S core and two PACDSP cores. In order to provide wide data bandwidth, it also consists of high performance DDR2 controller designed by ITRI and AMBA3 AXI system bus. The PAC Duo product can be easily applied to lots of different multimedia applications, including IPTV, DVB, and DVR. You can obtain the latest manuals or user guides here.

 

Android (PAC Duo SoC)

Android which uses a modified version Linux kernel has already become one of the most important mobile operating system. In order to support future applications based on Android, we have successfully ported Android to our PAC Duo SoC. In fact, all PAC Duo EVBs are Android ready. We'll continuously provide new applications and supports for Android for PAC Duo SoC. All new information will be provided as soon as possible here.

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 PAC_Duo_GPS_Demo_Video: The short video demonstrates how PAC Duo EVB, PAC Duo EVB GPS module, USB 3G dongle, and Google Map can be integrated. If you are interested in it, please contact with us!


 

Course

Becuase we hope that users can be familiar with our platform faster and easier, we also provides some training courses of PAC Duo platform, PAC EVB, and PACDSP processor. All these training courses we provide can be found here.

 

PAC Duo Platform Technical Forum



We don't provide any Web forum directly; however, Hua Hen Technology Co., Ltd.provides an Web forum for PAC Duo platform on Google Forum. If you have any technical problem about PAC Duo platform, you may post it on this PAC Duo Forum.

In addition, there are two unofficial Web forums of PACDSP programming. One is for discussing PACDSP programming and toolchains and the other is for discussing PACDSP assembly language programming. Because no one is responsible for these forums directly, we do NOT guarantee anthing about it. 

 



 

Wei-Min Cheng

☞ If you wish to know anything about PACDSP or the whole PAC platform, please contact with us.





Division for Embedded System and SoC Technology
Information and Communications Research Laboratories
Bldg. 9, No.195, Sec.4, Chung Hsing Rd.,
Chutung, Hsinchu 310,
Taiwan

Technical Support
Tel:+886-3-5917119
Tel:+886-3-5914589
E-mail: pacfae@gmail.com


Other Service
Tel:+886-3-5912863
Fax:+886-3-5913183
Email: changjengjr@itri.org.tw 
 



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